[Samsung Electronics Chairman Lee Jae-yong went to Japan to inspect advanced packaging technology and plans to invest 40 billion yen in five years] On November 1, Samsung Electronics Chairman Lee Jae-yong visited the Advanced Packaging Research Center (APL) in Yokohama, Japan on the 11th to inspect the research and development progress of next-generation semiconductor packaging materials and process technologies, and discussed with local researchers to strengthen cooperation with Japanese semiconductor materials, components and equipment companies. Samsung Electronics plans to invest 40 billion yen (approximately US$254 million) in the next five years starting from 2024 to build Yokohama APL into a global advanced packaging R&D center, and plans to expand local R&D personnel to more than 100 people by 2027. Research areas will also be expanded to next-generation packaging technologies such as wafer bonding and glass substrates.