[NVIDIA reveals next-generation CPO technology, prototype samples are in place] October 31st, NVIDIA recently publicly demonstrated the next-generation co-packaged optics (CPO) technology at SEMICON West 2026, called OOI (Optics-on-Interposer, integrated optics on the interposer). Different from existing CPO solutions, OOI chose to take the organic packaging substrate and integrate the optical engine directly onto the silicon interposer carrying the GPU, further moving the photoelectric conversion link closer to the chip core, providing a new interconnection idea for the next generation of ultra-large-scale AI clusters. According to Nikola Nedovic, chief research scientist at NVIDIA Research Institute, this solution replaces the current organic packaging substrate with a larger-area interposer. NVIDIA has now obtained prototype samples.