[Tianyue Advanced: Continued layout around advanced packaging heat dissipation interposers] September 11th, Tianyue Advanced stated at the 2026 semi-annual performance briefing held on September 11 that as AI computing power density continues to increase, while advanced packaging achieves higher integration, the pressure on heat dissipation and thermal management has also increased significantly. Silicon carbide has the characteristics of high thermal conductivity and high temperature resistance. It is used in advanced packaging-related heat dissipation and interposer layers. It helps to improve thermal conduction efficiency and support system stability under higher power density. In some solutions, it also takes into account the needs of integration density and packaging form optimization. The company has continued its layout around advanced packaging heat dissipation interposers and other directions, and has also promoted cooperation with customers. Related work is being promoted in collaboration with downstream customers.