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B
[Fangda Carbon: 6N-grade graphite has been supplied in batches to leading companies such as silicon carbide semiconductors] On September 17, Fangda Carbon stated at the 2026 semi-annual performance briefing meeting held on September 17 that 6N-grade graphite is mainly used in the optical fiber and semiconductor fields. The company has achieved batch supply in the optical fiber field, silicon semiconductor, and silicon carbide semiconductor leading companies, replacing similar imported products. At the same time, the company actively expands the semiconductor epitaxy market. Its core products mainly include ultra-high-purity isostatic graphite, semiconductor-grade high-purity carbon powder (completed technical research on natural graphite powder and artificial graphite powder), porous graphite, carbon felt and other products.
#semiconductor#optical fiber#semiconductor chip#third generation semiconductor#Refractory materials#silicon carbide09-17 13:42
B
[Xinyueeng and Xinjueneng collaborate to develop second-generation silicon carbide main drive chips and module combinations for mass production] On September 15th, Xinyueeng and Xinjueneng collaborated to independently develop and manufacture the second-generation automotive-grade silicon carbide (SiC) main drive chips and module combinations that have recently been put on the market. They have jointly developed a full series of third-generation chips and have been designated as main drive projects by many car companies in the passenger car field. Data shows that the second-generation 1400V silicon carbide chip produced this time has completed all-round performance optimization for vehicle high-voltage and high-frequency extreme working conditions. Previously, the two companies had achieved mass production of the first-generation silicon carbide chips in mid-2025.
#chip#semiconductor chip#third generation semiconductor#Refractory materials#silicon carbide09-15 11:50
B
[Tianyue Advanced: Continued layout around advanced packaging heat dissipation interposers] September 11th, Tianyue Advanced stated at the 2026 semi-annual performance briefing held on September 11 that as AI computing power density continues to increase, while advanced packaging achieves higher integration, the pressure on heat dissipation and thermal management has also increased significantly. Silicon carbide has the characteristics of high thermal conductivity and high temperature resistance. It is used in advanced packaging-related heat dissipation and interposer layers. It helps to improve thermal conduction efficiency and support system stability under higher power density. In some solutions, it also takes into account the needs of integration density and packaging form optimization. The company has continued its layout around advanced packaging heat dissipation interposers and other directions, and has also promoted cooperation with customers. Related work is being promoted in collaboration with downstream customers.
#AI computing power#Computing power#AI#third generation semiconductor#Refractory materials#silicon carbide#Advanced packaging#Tianyue Advanced09-11 11:15