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[It is reported that TSMC’s CoWoS supply shortage has caused customers to focus on Intel EMIB-T] On September 2, it was reported that TSMC’s CoWoS orders have been fully booked until 2027, and some customers even have to wait more than a year to get their orders. As TSMC's supply bottleneck persists, Intel's new technology is gaining attention as an alternative. It is reported that MediaTek officially announced in its recent financial report conference call that it plans to use both CoWoS and EMIB-T technologies to develop artificial intelligence application-specific integrated circuits (ASICs) on a large scale; Broadcom and Meta are also considering transitioning from CoWoS to EMIB to reduce costs, and Google and Nvidia have also shown strong interest in EMIB-T.
#AI#Meta#NVIDIA#Intel#TSMC#MediaTek#Google#Broadcom09-02 15:04
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[TSMC incorporates microchannel heat dissipation technology into its R&D blueprint] "Science and Technology Innovation Board Daily" reported on the 2nd that Chen Yanming, director of TSMC's advanced packaging R&D department, said that microchannel heat dissipation technology sets up micro fluid channels in the chip or package structure to bring the coolant closer to the heat source, which helps improve heat transfer efficiency. TSMC has begun to introduce related technologies and plans to jointly develop with the packaging architecture. Chen Yanming also said that TSMC can integrate 24 HBMs and a CoWoS version with an area greater than 14 times the mask size is expected to be implemented in 2029. From 2024 to 2029, the number of AI computing transistors that can be integrated in a single CoWoS package will increase by more than 48 times, and the HBM bandwidth will increase by 34 times, highlighting the need for simultaneous upgrades in heat dissipation technology.
#TSMC#AI#HBM#Advanced packaging09-02 08:58
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[Selected evening news on August 31st] 1. Seven departments including the Ministry of Commerce issued implementation opinions on promoting the expansion and upgrading of commodity consumption. By 2030, the total retail sales of consumer goods will reach about 60 trillion yuan. The retail sales of trillion-level categories such as automobiles, home appliances, communication equipment, textiles and clothing, etc. continue to grow. 2. The Ministry of Industry and Information Technology has launched a special campaign to cultivate artificial intelligence application service providers, exploring models such as first purchase, first use, and risk compensation to increase the procurement of services such as large models, agents, and tokens. 3. Artificial intelligence developers are increasingly using Mac mini and Mac Studio to train artificial intelligence models or run artificial intelligence agents, and OpenAI and Anthropic have also joined in purchasing such equipment. 4. TSMC stated that the underlying architecture of optical transceivers is undergoing structural changes. Silicon photonics has become the mainstream type, and the ultimate embodiment is co-packaged optics (CPO). In the second half of this year, some manufacturers will enter mass production. 5. Company news: ① Zhongji InnoLight: plans to repurchase 4 billion to 8 billion shares for equity incentives or employee stock ownership plans. ②International Composites: It is planned to raise no more than 5 billion yuan in additional capital to invest in projects such as high-performance electronic fiber cloth. ③ Suiyuan Technology: The IPO price of the Science and Technology Innovation Board is set at 142.18 yuan per share. ④ Zhipu’s revenue in the first half of the year was 953.9 million yuan, with an operating loss of 2.15 billion yuan. ⑤ Huawei’s revenue in the first half of the year was 467.8 billion yuan and net profit was 23.427 billion yuan.
#Anthropic#OpenAI#AI#MINI#TSMC#agent#large model#Huawei08-31 21:42
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[SK Hynix is ​​considering handing over some HBM base die to Intel for production] "Science and Technology Innovation Board Daily" reported on the 31st that SK Hynix is ​​considering handing over some HBM base die (Base Die) to Intel for production to reduce dependence on TSMC wafer foundry. This plan is expected to start with the seventh-generation HBM chip HBM4E. The analysis pointed out that for HBM4, TSMC’s basic die price is 3 to 4 times higher than the core chip produced by SK Hynix using its 10nm fifth-generation process. The cost burden is expected to increase further when transitioning to HBM4E. Given that HBM has a high proportion of long-term supply contracts (LTA), it is difficult for the company to immediately pass on the increase in foundry costs to product prices, so it needs to establish a multi-supplier system to improve its price negotiation capabilities. (Herald)
#Intel#TSMC#chip#wafer#semiconductor chip#HBM#memory chip08-31 11:46