[TrendForce: It is estimated that the output value of AI network and interconnection will reach US$279.8 billion in 2027. Scale-up’s proportion will rise to 24%] According to TrendForce’s latest AI Infra (AI infrastructure) industry research, as AI server clusters continue to expand and accelerator bandwidth requirements increase rapidly, it is estimated that global AI Networking & Interconnection (AI Networking & Interconnect) output value will grow from US$37.9 billion in 2024 to US$279.8 billion in 2027, with a compound annual growth rate of 95% from 2024 to 2027. The focus of market growth is extending from back-end network switches and optical modules to accelerator high-speed interconnect and network cards. In the future, the shipment mix and network topology of each AI chip platform will become the key to market size and supply chain value distribution. From the perspective of interconnection, the output value of high-speed interconnection (scale-up) between AI chips has grown the fastest. As GPU platforms develop towards cabinet-level architecture, chip interconnection gradually extends from server motherboards to independent switch trays, driving an increase in demand for switching equipment and copper cables. Based on AI cluster deployment caliber, scale-up's proportion of AI network output value will increase from 11% in 2024 to 24% in 2027. In 2027, the interconnection within the GPU cabinet will still be mainly copper cables, while Google TPU has expanded the cluster scale through ICI optical interconnection and optical switch (OCS).