[Industrialization of key chip packaging materials] On November 4th, the Hubei Provincial Department of Economy and Information Technology announced today on its official Weibo that Wuhan Flexible Technology Co., Ltd., a member of the Wuhan Advanced Functional Materials Industrial Innovation Joint Laboratory, announced that its independently developed electronic-grade polyimide (PI) series materials have been industrialized. Polyimide is a high-end polymer material that is resistant to high temperatures, has good insulation properties, and is dimensionally stable. It is commonly used in fields such as flexible displays and chip packaging. It is reported that at present, the localization rate of high-end photo-alignment materials for liquid crystal displays is less than 20%, and the localization rate of photosensitive protective polyimide materials for chip packaging is less than 15%. In the future, the project will gradually complete certification in major head panel, chip packaging and testing companies, and expand large-scale application in 3 to 5 years.