[Micron plans to significantly expand HBM production within the year and is expected to double its production capacity] "Science and Technology Innovation Board Daily" reported on the 4th that Micron plans to make large-scale equipment investments before the end of the year to enhance the supply capacity of the latest generation HBM-HBM4 12-layer products. This move is aimed at making up for its shortcomings in HBM production capacity compared to Samsung Electronics and SK Hynix, thereby increasing market share. Micron plans to add up to 60,000 pieces/month of HBM production capacity (in terms of wafers) by the end of this year. Last year, Micron's HBM production was about 40,000 to 50,000 pieces per month. Based on this calculation, Micron's HBM production capacity will be more than twice that of last year. An industry insider familiar with the situation said: "Micron is making large-scale equipment investments to quickly increase the production capacity of HBM4. It is expected that by the end of this year, Micron will have an HBM production capacity of approximately 100,000 pieces/month." (ETNews of Korea)