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[Bomin Electronics: Meizhou new factory Chuangxin Intelligent Manufacturing Park mainly produces high-end PCBs Currently in a production capacity ramp-up period] On September 11, Xu Xu, chairman and general manager of Bomin Electronics, said at today’s semi-annual performance briefing that Meizhou’s new factory Chuangxin Intelligent Manufacturing Park (Phase I) was officially put into production in the first quarter of this year, and its main production is the fastest growing in the current segment. High-end PCB products such as high multi-layer and high-reliability HDI are deeply anchored in downstream applications in artificial intelligence, high-speed communications, smart cars and other fields. It has 52 layers, a thickness-to-diameter ratio of 30:1 through-hole capabilities and 7-level HDI production capabilities, with a planned production capacity of 360,000 square meters per year. Chuangxin Intelligent Manufacturing Park is currently in a production capacity ramp-up period, with product yields steadily increasing. (Reporter Lu Tingting)
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