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[Teradyne launches semiconductor manufacturing equipment platform for edge AI applications] On October 27, Teradyne, a global supplier of automatic test equipment and robots, recently announced the launch of the UltraFLEXplus S series. This series of test platforms is an expanded version of the UltraFLEXplus platform. It is specially designed for the semiconductor manufacturing needs of edge AI applications. It is designed to adapt to multi-category and variable-volume production models while maximizing unit area output and operational efficiency. The first model, UltraFLEXplus S24, is a 24-slot system that takes into account both engineering development and mass production scenarios, and meets the most important economic needs of integrated device manufacturers (IDMs) and outsourced semiconductor packaging and testing (OSAT) manufacturers.
#Semiconductor manufacturing#Edge AI#semiconductor#robot#AI#semiconductor chip#AI application#U.S. stock trends10-27 15:39
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On September 21, semiconductor company Microchip Technology has completed the acquisition of Israeli edge AI chip manufacturer Hailo.
#Edge AI#AI chip#semiconductor#chip#U.S. stock trends09-21 21:01
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[New Unigroup Co-President Chen Jie: Will establish a joint innovation center for general artificial intelligence with Arm] On September 8, Chen Jie, co-president of New Unigroup, announced a deepening of strategic cooperation with Arm. The cooperation between the two parties will cover Arm technologies such as Arm AG ICPU and Arm Computing Subsystem (CSS). The two parties also plan to establish a joint general artificial intelligence innovation center in China to carry out exploration and innovation around AI agent orchestration, CXL memory pooling, rack-level system architecture, edge AI and other technical directions. (Daily Economic News)
#AI agent#AI#Edge AI#agent#CPU#Arm#Memory09-08 12:58