[Teradyne launches semiconductor manufacturing equipment platform for edge AI applications] On October 27, Teradyne, a global supplier of automatic test equipment and robots, recently announced the launch of the UltraFLEXplus S series. This series of test platforms is an expanded version of the UltraFLEXplus platform. It is specially designed for the semiconductor manufacturing needs of edge AI applications. It is designed to adapt to multi-category and variable-volume production models while maximizing unit area output and operational efficiency. The first model, UltraFLEXplus S24, is a 24-slot system that takes into account both engineering development and mass production scenarios, and meets the most important economic needs of integrated device manufacturers (IDMs) and outsourced semiconductor packaging and testing (OSAT) manufacturers.