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[TSMC incorporates microchannel heat dissipation technology into its R&D blueprint] "Science and Technology Innovation Board Daily" reported on the 2nd that Chen Yanming, director of TSMC's advanced packaging R&D department, said that microchannel heat dissipation technology sets up micro fluid channels in the chip or package structure to bring the coolant closer to the heat source, which helps improve heat transfer efficiency. TSMC has begun to introduce related technologies and plans to jointly develop with the packaging architecture. Chen Yanming also said that TSMC can integrate 24 HBMs and a CoWoS version with an area greater than 14 times the mask size is expected to be implemented in 2029. From 2024 to 2029, the number of AI computing transistors that can be integrated in a single CoWoS package will increase by more than 48 times, and the HBM bandwidth will increase by 34 times, highlighting the need for simultaneous upgrades in heat dissipation technology.

#TSMC #AI #HBM #Advanced packaging09-02 08:58