Telegraph

7x24 real-time news feed, auto refreshBeijing Time:

B
[ZTE CTO Wang Xiyu: The new generation data center network NPO solution is providing a better solution for AI Fabric] October 17th, the 10th Future Network Development Conference was held in Nanjing, Jiangsu from October 15th to 17th. Wang Xiyu, executive vice president and chief technology officer of ZTE, pointed out in his speech that with the rapid development of large AI models and computing power clusters, profound changes have occurred in the data center domain, wide area, and air and space domain businesses. For data center domain scenarios, optical devices are gradually moving closer to electrical chips, which is a significant trend in optical interconnection. NPO takes into account the advantages of openness, cost and maintainability, and intra-node interconnection is the main scenario of NPO. Wang Xiyu said that ZTE’s new generation data center network NPO solution is providing better solutions for AI Fabric and becoming a pioneer in the development of high-density bandwidth. Facing the space and space domain scenarios, satellite laser communications are extending the network from the ground to space. In terms of bandwidth capabilities, ZTE is promoting the commercial verification of spaceborne 100G/200G products. 400G/800G core chips and optical devices are also being verified, which can meet the needs of the long-term evolution of spaceborne laser applications. In terms of product form, it supports "lasers and routing can be separated and combined" to adapt to the needs of different satellite platforms. High-value scenarios integrating space and ground are taking root. (Securities Times)
B
[CICC: Optical communications industry will be highly prosperous in 2027 with certainty to increase] On September 16, CICC Research reported that the popularity of the 27th Optical Expo has increased compared with previous years, with more than 4,000 companies participating in the exhibition, and the overall number of visitors was nearly 190,000, a year-on-year increase of 32%. "Locking orders" and "locking materials" have become keywords for exhibition research, and the certainty of demand in 2027 will further increase. Based on exhibition research, the order schedule of some high-speed optical chip companies has been extended to 2028 and beyond, and the visibility of optical module orders covers 2027 and beyond; leading optical module manufacturers are actively targeting core materials such as DSP, mSAP PCB, and high-speed optical chips. It is expected that the difference in subsequent delivery will depend more on key material security, yield and customer certification, among which advanced process DSP may become the most scarce link. It is expected that by 2028, after standards and engineering solutions gradually converge and yields increase, NPO is expected to accelerate volume expansion, and CPO may gradually enter Scale-up; OCS will move from a few cloud vendors for self-use to more AI clusters, driving the sinking of 2.4T light coherent applications; 400G per lane promotes device upgrades, and thin film lithium niobate is expected to accelerate its entry into customer verification and application windows.