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All A·Important B·Normal #memory chip ✕
B
[GigaDevice: The tight DRAM supply situation will not be significantly alleviated in 2027] On September 1, at the semi-annual results meeting, He Wei, vice chairman and general manager of GigaDevice Innovation, analyzed that in terms of DRAM products, the company expects that the upward trend will continue in the second half of the year, and prices will turn to a moderate upward trend. Looking forward to 2027, the release of incremental production capacity in the DRAM industry will be relatively limited, the tight situation of DRAM supply will not be significantly alleviated, the industry boom cycle will be relatively long, and product prices will be high and volatile. In terms of SLC NAND Flash products, the company believes that the business cycle will be relatively long, at least until the whole year of 2027. (Securities Times)
#memory chip09-01 20:56
B
On September 1, Goldman Sachs stated that storage prices are still on an upward channel and maintained "buy" ratings for Samsung and SK Hynix.
#Samsung#memory chip#Brokerage strategy09-01 20:41
A
[SK Hynix is ​​considering handing over some HBM base die to Intel for production] "Science and Technology Innovation Board Daily" reported on the 31st that SK Hynix is ​​considering handing over some HBM base die (Base Die) to Intel for production to reduce dependence on TSMC wafer foundry. This plan is expected to start with the seventh-generation HBM chip HBM4E. The analysis pointed out that for HBM4, TSMC’s basic die price is 3 to 4 times higher than the core chip produced by SK Hynix using its 10nm fifth-generation process. The cost burden is expected to increase further when transitioning to HBM4E. Given that HBM has a high proportion of long-term supply contracts (LTA), it is difficult for the company to immediately pass on the increase in foundry costs to product prices, so it needs to establish a multi-supplier system to improve its price negotiation capabilities. (Herald)
#Intel#TSMC#chip#wafer#semiconductor chip#HBM#memory chip08-31 11:46
B
On August 31, the chairman of SK Group said that SK Hynix is ​​considering building a joint venture factory in Japan to produce memory chips.
#chip#semiconductor chip#memory chip#Global market intelligence08-31 09:29
A
[Changxin Storage Official Announcement: LPDDR6 memory is officially mass-produced] On August 29, Changxin Storage announced that Changxin LPDDR6 memory was officially mass-produced, and Xiaomi 18 Fold new folding flagship mobile phone was launched for the first time.
#Millet#Memory#memory chip08-29 11:49