Sony releasedPlayStation5 ProofLatest official disassembly report, focusing on its improvements to the host cooling device. These improvements include adjustments to the PS5’s liquid metal cooling design, aiming to make the console’s heat dissipation “more stable.”
The changes come after various rumors surfaced that the liquid metal used in the first PS5 could leak and damage the console. Some sites are even advising against holding the PS5 vertically after jailbreak site Wololo.net partially misquoted a repair shop owner and YouTuber. Wololo later followed up, saying there was a "serious misunderstanding" in its original reporting - which, ultimately, never seemed to be a widespread problem.
Even so, Sony wrote that it had changed the design of the PS5 Pro, quoting mechanical design lead Shinya Tsuchida:
When designing the original PS5, we spent considerable time researching thermal insulation. The basic structure of PS5 Pro remains the same, but we have made some improvements and added tiny bangs where liquid metal is applied to make the heat dissipation effect more stable. During the development of the original PS5, we predicted that semiconductors would continue to evolve and become much denser, so we believed liquid metal technology would become critical. It turns out we were right, and it played an integral role in the design of PS5 Pro.
If you've seen iFixit's teardown of Sony's very expensive console, you're probably familiar with the rest of the blog post and its images, which point out that there's more thermal management inside the PS5 Pro than electronics.
These include a larger cooling fan, and the company says it redesigned the fan blades to include "installing smaller blades between the blades." The blog also explains why the traces on the PS5 Pro motherboard are so difficult to see: there are extra electrical layers hidden underneath the motherboard to speed up memory access.