Siemens and Intel, one of the world's largest semiconductor companies, have signed a memorandum of understanding (MoU). The two parties will cooperate to promote the digitalization and sustainable development of microelectronics manufacturing. The two companies will focus on advancing the future of manufacturing, developing factory operations and cybersecurity, and supporting the creation of a resilient global industrial ecosystem.
"Semiconductors are the lifeblood of the modern economy. Nothing runs without chips. Therefore, we are honored to work with Intel to rapidly advance semiconductor production." Cedrik Neike, CEO of Siemens Digital Industries and member of the Management Board of Siemens AG, said: "Siemens will bring its entire cutting-edge product portfolio of IoT hardware, software and electrical equipment to this collaboration. "Our joint efforts will help achieve global sustainable development goals. "
The MoU identifies key areas for collaboration to explore initiatives including optimizing energy management and addressing carbon footprint issues across the value chain. For example, the collaboration will explore the use of "digital twins" of complex, highly capital-intensive manufacturing facilities to standardize solutions.
The collaboration will also explore minimizing energy use through advanced modeling of natural resource and environmental footprints across the value chain. To gain access to more product-related emissions information, Intel will explore product and supply chain-related modeling solutions with Siemens to drive data-based insights and help the industry accelerate progress in reducing its collective footprint.
Keyvan Esfarjani, executive vice president and global chief operating officer of Intel, said: "The world needs a more globally balanced, sustainable and resilient semiconductor supply chain to meet the growing demand for chips. We are excited to expand our cooperation with Siemens and build on Intel's advanced manufacturing capabilities to open up new areas and leverage Siemens' portfolio of automation solutions to improve the efficiency and sustainability of semiconductor infrastructure, facilities and factory operations. This memorandum of understanding will benefit regional and global industry value chains."
Siemens and Intel will combine their strengths and expertise in sustainable practices throughout the semiconductor life cycle, including design, manufacturing, operations, efficiency and recycling, which are critical to meeting the growing demand for powerful, sustainable chips. Technology has the power to accelerate solutions for reducing computing-related climate impacts across the technology industry and other areas of the global economy. Automation and digitalization are key to meeting the challenge as the industry strives to achieve net-zero greenhouse gas emissions.