Due to the rapid development of companies such as NVIDIA in the field of AI chips, TSMC's demand for advanced packaging services has surged, forcing it to arrange production plans several months in advance.TSMC occupies a dominant position in the field of advanced packaging technologies such as CoWoS and is one of the major suppliers of this technology. However, in the face of huge market demand, TSMC is no longer able to meet customer needs alone.
The deputy general manager of TSMC's advanced packaging technology said that the company must speed up the formulation of packaging product roadmaps to keep up with the AI mass production roadmaps of companies such as NVIDIA.
The report pointed out that as customers forced TSMC to speed up the production process by more than three-quarters, sometimes even by a year, the traditional "step-by-step, sequential" way of deploying packaging production lines is no longer feasible.
In order to cope with this challenge, TSMC is adopting a series of "future-oriented" strategies, including ordering the required equipment in advance and cooperating with local packaging suppliers to form the "3DIC Advanced Packaging Manufacturing Alliance", whose members include TSMC, ASE and a number of companies.
The product cycle of AI GPU manufacturers such as NVIDIA is usually 6 months to one year, which makes the demand for advanced packaging technologies such as CoWoS and SoIC continue to rise.
For example, NVIDIA's Rubin will debut six months after Blackwell Ultra goes into mass production. Due to the huge architectural differences between the two product lines, TSMC and other companies need to take corresponding measures to ensure on-time delivery.
