Samsung Electronics recently made organizational adjustments to its high-bandwidth memory (HBM) development team, canceling the HBM development team that was originally affiliated with the DS department of the semiconductor business, and integrating the relevant personnel into the DRAM development room.This change has caused the market to pay attention to the pace of Samsung HBM’s business advancement and internal synergy efficiency.
In terms of adjustment arrangements, the original HBM team members will be transferred to the design team under the DRAM development room and will continue to be responsible for the research and development of next-generation HBM products and technologies. Sun Yongzhu, who previously led the HBM team, was appointed as the head of the design team to coordinate the advancement of related projects.
Next, the team will focus on the design optimization and process verification of new products such as HBM4 and HBM4E. Samsung is expected to complete organizational adjustments this week and hold a global strategy meeting early next month to review next year's business plan.
In terms of business, Samsung has continued to increase investment in the HBM field in recent years and has established cooperation with many technology companies such as Nvidia, AMD, OpenAI, and Broadcom.Based on the mass production experience of HBM3 and HBM3E, the company continues to improve its core capabilities such as stacking packaging, bandwidth, energy efficiency and reliability. Korean media analysts believe that integrating HBM development into the DRAM system will help form closer collaboration in process evolution, design verification and mass production introduction.
From the perspective of market competition, Samsung's ranking in the global HBM market fell to third place in the second quarter of this year, and it is facing periodic competitive pressure. The company expects that as the supply scale of HBM4 gradually expands, its market share is expected to rebound from next year.
According to TrendForce forecast,By 2026, Samsung's share of the global HBM market is expected to exceed 30%, which also provides confidence support for it to strengthen its advanced storage layout.
Industry observers point out that HBM, as a key storage component that supports artificial intelligence training, reasoning and high-performance computing, has become a strategic location for storage manufacturers to compete for deployment. By integrating the HBM team into the DRAM development system, Samsung is expected to improve resource coordination and technology iteration efficiency, and enhance its competitiveness in the high-end storage market.
