According to ZDNet,Samsung is developing a new chip packaging structure called "Side-by-Side" (SbS). This technology is expected to be applied to future Exynos series processors, thereby bringing breakthrough changes in the heat dissipation performance and body design of smartphones.
In traditional chip packaging, processors and memory usually adopt a vertical stacking layout. Samsung's SbS technology changes this approach by arranging chip modules and DRAM memory horizontally side by side, and covering them with a unified heat transfer block (HPB).
First, in terms of heat dissipation, since the chip and DRAM are laid out side by side and share the HPB above, heat can be exported more evenly and quickly, thereby significantly improving the device's temperature control capabilities.
Secondly, this horizontal layout can effectively reduce the overall thickness of the packaging structure, which provides key technical support for manufacturing slimmer mobile phones. If Samsung restarts form-conscious designs like the Galaxy S26 Edge in the future, SbS packaging will become an important support.
In addition, other mobile phone manufacturers pursuing thin and light designs can also choose to use this packaging technology if they use Samsung's 2nm GAA process chips.
There is no word yet on which platform SbS will be applied to first. Although there is news that Samsung is testing the Exynos 2600 chip for the upcoming Galaxy Z Flip 8 folding phone, since SbS technology is particularly beneficial for ultra-thin devices, Samsung may also adjust its plans to make it debut on a more suitable model.
Market analysts generally believe that Exynos 2700 is likely to become the first processor to benefit from SbS technology.The more anticipated one is the Exynos 2800, which is expected to be Samsung’s first chip equipped with a completely self-developed GPU. Since the application scope of Exynos 2800 may extend beyond mobile phones to more fields, the use of SbS packaging will further unleash its performance potential.
