NVIDIA CEO Jen-Hsun Huang recently hosted a banquet for senior supply chain partners.During this period, Huang Renxun said that TSMC must work very hard this year because NVIDIA needs a lot of wafers.Huang Renxun revealed that NVIDIA has now fully put into production Blackwell and next-generation Vera Rubin chips. The latter includes six of the world's most advanced chips, both of which require a large amount of wafer and CoWoS packaging production capacity.

Huang Renxun emphasized that TSMC is working very hard, but NVIDIA has a huge demand this year, so it needs a lot of production capacity.

He predicted: "TSMC's production capacity may grow by more than 100% in the next ten years, which is a very significant scale expansion and the largest infrastructure investment in human history, and it will have to be doubled just to meet NVIDIA's demand."

Thanks to the strong momentum of products such as Grace Blackwell, NVIDIA has surpassed Apple and become TSMC's largest customer in just a few years.

TSMC has even opened up a capacity prepayment option for this purpose, ensuring that most of the capacity of new production lines in the future will be prioritized for NVIDIA and other high-performance computing (HPC) customers.