According to Bloomberg reporter Mark Gurman, Apple plans to introduce a new heat pipe cooling system for the iPad Pro as soon as next year to cope with increasing performance needs. Gurman said in his latest Power On newsletter that this solution will refer to the heat pipe design used on the iPhone 17 Pro. It is Apple’s new heat dissipation architecture for the ultra-thin iPad Pro and is expected to debut on the next generation model expected to be released in the spring of 2027.
Apple has previously significantly modified the internal heat dissipation structure on the iPhone 17 Pro series, introducing heat pipe cooling: a small amount of deionized water circulates in the closed structure to export and disperse the heat generated by the A19 Pro chip to the entire aluminum integrated body. Apple claims that this design can increase sustained performance by about 40% under high load scenarios, significantly improving the stable performance of heavy applications and games.
The report pointed out that the next-generation iPad Pro is expected to be equipped with Apple's M6 chip manufactured by TSMC's 2-nanometer process, and the overall performance and energy efficiency will be further improved. As performance continues to rise and professional applications and complex workflows continue to converge on iPad Pro, the introduction of a liquid-cooled heat pipe structure is expected to effectively suppress frequency reduction during long-term high-load use, ensuring more stable performance output, while leaving more room for maintaining an ultra-thin design.