Micron Technology announced at the NVIDIA GTC 2026 conference that it has simultaneously achieved high-volume production of three key products for data centers and AI loads, all of which revolve around and serve NVIDIA's new generation Vera Rubin platform. The most talked about is HBM4 high-bandwidth video memory: a 12-layer stacked product with a capacity of 36 GB, which will begin mass shipments in the first quarter of 2026 and is specially built for NVIDIA Vera Rubin chips.
With a pin rate of more than 11 Gb/s and a total bandwidth of more than 2.8 TB/s, this HBM4 is 2.3 times faster than the previous generation HBM3E, while improving power efficiency by more than 20%. Micron has also delivered early samples of the higher-capacity 16-layer stacked 48 GB HBM4 to customers. Compared with the 12-layer stacked solution, the capacity of each HBM package is increased by approximately 33%.
In addition to HBM4, Micron announced that its 192 GB SOCAMM2 memory module has also entered high-volume production. This module is designed for Vera Rubin NVL72 systems and independent Vera CPU platforms, enabling up to 2 TB of memory capacity and 1.2 TB/s memory bandwidth on a single CPU platform. The entire SOCAMM2 portfolio spans capacities from 48 GB to 256 GB, with the latter previously announced as "the world's first 256 GB high-capacity LPDRAM SOCAMM2" for data center infrastructure.
In terms of storage, Micron 9650 has become the industry's first PCIe Gen 6 SSD for data centers and has been specially optimized for the NVIDIA BlueField-4 STX architecture. It is also now in mass production. According to reports, this enterprise-class SSD has a sequential read speed of up to 28 GB/s and a random read performance of 5.5 million IOPS, almost doubling the read performance of the previous generation PCIe Gen 5 products. At the same time, its performance/power consumption ratio has also been increased to twice that of the previous generation products, which has obvious advantages in data center scenarios that emphasize energy efficiency.
By simultaneously entering the high-volume production stage for its three product lines of HBM4 video memory, SOCAMM2 high-density memory and PCIe 6.0 enterprise-class SSD, Micron hopes to occupy a more important supply chain position in the new round of AI infrastructure construction cycle surrounding Vera Rubin.