[SK Hynix is ​​considering handing over some HBM base die to Intel for production] "Science and Technology Innovation Board Daily" reported on the 31st that SK Hynix is ​​considering handing over some HBM base die (Base Die) to Intel for production to reduce dependence on TSMC wafer foundry. This plan is expected to start with the seventh-generation HBM chip HBM4E. The analysis pointed out that for HBM4, TSMC’s basic die price is 3 to 4 times higher than the core chip produced by SK Hynix using its 10nm fifth-generation process. The cost burden is expected to increase further when transitioning to HBM4E. Given that HBM has a high proportion of long-term supply contracts (LTA), it is difficult for the company to immediately pass on the increase in foundry costs to product prices, so it needs to establish a multi-supplier system to improve its price negotiation capabilities. (Herald)