[SK Hynix accelerates the deployment of iHBM technology, and the heat dissipation capacity of the new generation HBM is increased by 30%] "Science and Technology Innovation Board Daily" reported on the 22nd that South Korean memory chip giant SK Hynix is ​​promoting the new generation of iHBM (Integrated High Bandwidth Memory) technology to the mass production stage, and has begun to discuss related mass production plans. Facing the surge in demand for computing power brought about by the rapid development of the artificial intelligence industry, the heat dissipation problem of high-bandwidth memory (HBM) is becoming an important bottleneck affecting performance improvement, and iHBM is regarded as an important technical route to solve this problem. iHBM will place cooling elements called integrated cooling elements (ICE) in the inter-die physical layer (D2D PHY) to reduce thermal resistance by up to 30%.