[Preview: The Semiconductor Packaging and Testing Annual Conference will be held from November 4th to 6th with many listed companies participating] October 27th, the 24th China Semiconductor Packaging and Testing Technology and Market Annual Conference will be held at Nanjing Fengda International Hotel from November 4th to 6th. During the two-day conference, leading companies from Huatian Technology, Changdian Technology, Tongfu Microelectronics, Nanjing TSMC, Biren Technology, BOE, Yuntian Semiconductor and other fields of semiconductor packaging and testing, chip design, glass substrates, advanced packaging and testing equipment, etc. will exchange the latest development directions of advanced packaging through the main forum, special reports, supply and demand docking, etc. This annual packaging and testing conference is guided by the China Semiconductor Industry Association, hosted by the China Semiconductor Industry Association Packaging and Testing Branch, hosted by Huatian Technology and Future Semiconductor, and co-organized by Changdian Technology, Tongfu Microelectronics, and Zhongkexin Integrated Circuit Co., Ltd.