[Samsung Electronics’ first of three major projects, the HBM factory, is scheduled to be put into operation one year ahead of schedule] On November 12, Samsung Electronics Chairman Lee Jae-yong announced plans to build the Onyang Park in Asan, Chungcheongnam-do, South Korea, into a core production base for the next generation of high-bandwidth memory (HBM). In response to the explosive demand for AI chips, Samsung Electronics has put the new HBM factory in Onyang into production about one year earlier than originally planned, and is scheduled to be put into production in June 2028. This is the first of the three large-scale projects promoted by Samsung Group to start construction. It has been 133 days since the investment plan for the Chungcheong area was announced on July 2.