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[Samsung opens advanced chip packaging R&D center in Japan] On September 8, Samsung Electronics has opened an advanced semiconductor packaging R&D center in Yokohama, Japan. Samsung has previously announced that it plans to invest approximately 40 billion yen over five years from 2024 to expand the laboratory’s research infrastructure and strengthen advanced packaging technology.
semiconductor chip 🕐 2026-09-08 17:20
#semiconductor #chip #Samsung #semiconductor chip
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