[Sripu: A full range of optical communication analog chip solutions are unveiled, and relevant solutions have completed customer verification] September 10th, according to the official WeChat account of Sirip, from September 9th to 11th, Sirip participated in the 27th China International Optoelectronics Expo (CIOE China Optical Expo) to showcase innovative solutions for analog and digital-analog hybrid chips for the field of optical communications. The exhibits cover 800G/1.6T pluggable high-speed optical module solutions (adapted to silicon photonics and EML dual technology routes), CPO/NPO co-packaged optics and ELSFP external light source mass production supporting solutions, OCS all-optical switching complete set of control solutions, and coherent optical modules and EDFA optical amplification full-link solutions. Among them, in view of the development direction of next-generation high-density optoelectronic integration technology, two complete solutions of Sirip CPO/NPO co-packaged optics and ELSFP external light source have completed customer verification, effectively helping customers shorten the product development cycle and accelerate product introduction to the market.