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[Laser annealing integrates optical isolators directly into silicon photonic chips] On September 15th, Japan’s Kyocera Corporation and scientists from the Institute of Electrical and Communications Technology of Tohoku University developed a new laser annealing technology. It only heats the area that needs to be processed, and can integrate the optical isolator directly onto the silicon photonic chip without damaging the surrounding components. Relevant papers were published in "IEEE Access", an academic journal of the Institute of Electrical and Electronics Engineers.
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