Abstract:
According to people familiar with the matter, Broadcom's Wall Street underwriting team is working to raise US$60 billion in new AI chip financing, with beneficiaries including Anthropic and other companies. People familiar with the matter said that many banks involved in this huge debt plan are about to issue underwriting invitation letters for US$42 billion in Class A senior secured bonds.
Sources said that Blackstone Group took the lead in 18 billion U.S. dollars of Class B subordinated debt. Several of Blackstone's funds committed to invest 9 billion U.S. dollars, and the remaining part was planned to be distributed externally.
A Broadcom spokesman declined to comment.
The financing plan has been in preparation for weeks and is being closely watched by Wall Street and Silicon Valley professionals. In the context of public opinion's resistance to data center construction, the market hopes to confirm that investors are still willing to continue investing in AI infrastructure. Broadcom hopes to sell more chips and data center equipment to challenge Nvidia; while AI companies such as Anthropic need to continue to expand computing power.
People familiar with the matter said during negotiations in August that the potential deal would help Anthropic and other companies obtain chips and other critical AI infrastructure. This financing is an additional part of the hundreds of billions of dollars of AI infrastructure debt that has been raised. Although most of the money is used to build data centers, financing transactions for purchasing chips and servers are also increasing.
In August, Nvidia also announced that it would cooperate with six major financial giants including Blackstone to mobilize more than US$500 billion in funds to invest in the AI field, including assisting customers in financing the purchase of Nvidia chips.
At the same time, Blackstone’s investment in Anthropic has boosted the performance of its private equity funds for high-net-worth clients.
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