Abstract:
Samsung Electronics said on Tuesday it had joined an alliance led by Dutch semiconductor equipment maker ASML to jointly develop next-generation semiconductor manufacturing technology. The South Korean technology giant said the collaboration aims to advance the development of 12-inch photomask technology to replace the 6-inch photomask format that has been widely used for decades.
Samsung said in a press release: "Building on years of successful cooperation, the two companies will work together to advance the research, development and deployment of advanced technologies to meet the growing performance and efficiency requirements of advanced semiconductor manufacturing."
This technology is expected to improve fab production efficiency and reduce chip manufacturing costs amid the surge in demand for artificial intelligence (AI) chips.
Samsung Electronics CEO Jeon Young-hyun said: "The era of artificial intelligence is reshaping the semiconductor industry, making technological innovation throughout the value chain increasingly important. By further strengthening our cooperation with ASML, we are laying the foundation for the next generation of artificial intelligence and semiconductor innovation."
Samsung also plans to apply ASML's high numerical aperture (High NA) extreme ultraviolet (EUV) lithography technology to the mass production of dynamic random access memory (DRAM) for the first time by 2028.
High numerical aperture EUV technology is expected to promote the expansion of DRAM processes by providing higher resolution, achieving process simplification and higher manufacturing efficiency.
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