Abstract:
ASML has secured a commitment from a top chipmaker to use its latest semiconductor production equipment, launching a broader deal to meet surging demand for more powerful AI technology. Samsung Electronics and TSMC plan to join Intel in adopting the Dutch company's high numerical aperture extreme ultraviolet (EUV) lithography equipment for mass production no later than 2028 and starting in 2030 respectively.
The unit price of this equipment can reach US$400 million. Samsung is the leading memory chip maker, while TSMC is the chip foundry leader for companies including Nvidia and Apple.
The four companies also agreed on important changes in photomask technology specifications. Photomasks are key components in semiconductor production. As the industry struggles to meet surging demand for AI, they plan to change the current 6-inch photomask format standard to 12 inches to increase production efficiency and reduce costs. A photomask is similar to an engraved woodblock used to print the same image over and over again, except that it "prints" on a silicon wafer with light.
Although the use of larger photomasks has long been considered complex and expensive, this coordinated effort is expected to significantly benefit chip manufacturing. ASML Chief Technology Officer Marco Pieters said that this new technology can increase the output capacity of high numerical aperture equipment by 40% and simplify the design process.
“This is a huge opportunity, and of course it means that production efficiency will be greatly improved,” Pieters said in an interview.
Currently, only ASML in the world can produce EUV lithography equipment, which is a necessity for manufacturing the world's most advanced AI computing chips and similar chips. ASML launched a low numerical aperture EUV system in 2019, and has since been studying with customers to adopt high numerical aperture equipment with more advanced performance.
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