📅 10-13
Musk: Tesla and SpaceX plan to rely on Terafab to test 10 sets of chip designs every year
Summary: Tesla and SpaceX CEO Elon Musk said that the two companies plan to manufacture and test about 10 sets of chip d
wafer
38 articles
📅 10-13
GlobalFoundries announces FDX Fusion roadmap: Targeting 7nm-level digital performance, Dresden plans mass production in 2028
Abstract: GlobalFoundries (GF) announced the FDX Fusion fully depleted silicon-on-insulator (FD-SOI) process route, whic
📅 10-12
CEOs of Intel and Broadcom warn: Financial constraints may become the biggest bottleneck for artificial intelligence
Abstract: Although demand for computing infrastructure continues to outstrip supply, the CEOs of Intel and Broadcom have
📅 10-12
Changxin G6 memory area reduced by another 30%, bonding process debuts
Abstract: The technical indicator forecast of domestic DRAM manufacturer Changxin Technology’s next-generation memory te
📅 10-12
Rare across-the-board price increase: ASML lithography machine parts increase by 10% across the board, Korean storage giant accepts them all
Summary: ASML (ASML), the world's largest semiconductor equipment manufacturer, will increase the price of all equipment
📅 10-11
Changxin Memory bets on new DRAM architecture and is expected to achieve commercial breakthrough two years earlier than Samsung
Abstract: Chinese memory chip manufacturer Changxin Memory (CXMT) is accelerating its next-generation DRAM technology la
📅 10-08
SK Hynix's HBM hybrid bonding technology development encounters obstacles, Samsung may temporarily lead in next-generation high-bandwidth memory competition
Abstract: According to Korean industry insiders, SK Hynix, the global high-bandwidth memory (HBM) market leader, is enco
📅 10-07
Japan's Rapidus receives approximately US$15 billion in government support and aims to launch 2nm chip foundry mass production in one year
Abstract: Rapidus, a chip manufacturer supported by the Japanese government, is stepping up its efforts to build a custo
📅 10-05
Reports indicate that China has stockpiled 343 immersion DUV lithography machines and may have the ability to continue to promote 7nm chip production
Abstract: A latest research report shows that despite strict restrictions on the export of advanced EUV lithography mach
📅 10-05
Russia spends 87 billion yuan to build 14nm wafer factory: completed in 2036, targeting 300mm wafers
Abstract: Under the framework of the establishment of the "United Microelectronics Company" (ОМК), Russia plans to build
📅 10-03
TSMC approaches Musk's Terafab project, U.S. industry chain integrated wafer factory plan emerges
Summary: TSMC is exploring the possibility of cooperation with Elon Musk’s Terafab project. According to recently disclo