Abstract:
Sony was recently discovered to have launched a PlayStation 5 Slim console version with a new internal design, which has been adjusted mainly for the cooling system, internal layout and maintainability. Although there are almost no changes in appearance, the new version of the hardware is believed to be expected to improve the cooling performance and reliability of the host during long-term operation.
This change was first discovered by maintenance technician Modyficator89 when he dismantled the "Marvel Wolverine" limited edition PS5 Slim set. The disassembly photos show that the new console uses a new motherboard numbered EDM-051, which has undergone many internal modifications compared with the previous version.
The most talked about improvements focus on the liquid metal cooling system. Sony continues to use liquid metal as the thermal conductive material between the APU processor and the heat sink, but has redesigned the structure around the processor that holds the liquid metal in place. The new boundary design reduces the exposed area of liquid metal and creates a better seal, thereby reducing the possibility of liquid metal spreading to surrounding components.
This improvement is considered significant. Since liquid metal has extremely high thermal conductivity and electrical conductivity, once displacement or leakage occurs, it may affect system stability or even cause hardware failure. The new design is expected to more effectively keep liquid metal within a designated area, improving long-term reliability while maintaining heat dissipation efficiency.
The new PS5 Slim also uses a redesigned radiator. Disassembly information shows that its material and structure are different from the early Slim version, and the overall idea is similar to the heat dissipation solution Sony previously used on the PS5 Pro. This means that some proven high-end model designs have begun to be transferred to the standard product line.
In addition to the cooling system, Sony has also adjusted the layout of some components. One of the obvious changes is that the position of the CMOS battery has been redesigned. The battery is now easier to access and replace, and users can complete maintenance without large-scale disassembly in the future. This also draws on the internal structure design concept of PS5 Pro.
The disassembly process also revealed that Sony replaced the HDMI signal retiming chip with a lower-cost one. The industry believes that this reflects that the company is continuously optimizing manufacturing costs and production processes while improving reliability.
It is unclear how much of a temperature improvement or lifespan improvement the new design will actually bring because the changes have not yet been verified by large-scale independent testing. At the same time, Sony has not officially announced this hardware revision, so it is temporarily unclear whether the EDM-051 motherboard will become standard configuration for all new PS5 Slims, or whether it will only appear in some specific sets or batches of products.
As more users and repair organizations dismantle and test the new console, the actual effects of Sony’s internal upgrade are expected to become clear in the coming weeks. For new users who plan to buy PS5 Slim, if these improvements prove effective, they may mean getting a new version of the console with better cooling performance, easier maintenance, and higher long-term stability.
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