iPhone15Pro and iPhone15ProMax use TSMC’s world’s first 3nm SoCA17Pro, but if Apple cannot provide a decent thermal solution to control the temperature of the chipset when running high-intensity applications, then all this will be in vain. Due to this oversight, Apple's latest A-series chips still inevitably hit a temperature wall, causing games such as "Genshin Impact" to freeze uncontrollably. Fortunately, a Chinese player took it upon himself to install a heat pipe on the iPhone 15 Pro, giving it stronger heat dissipation capabilities.
Running "Genshin Impact" on the modified iPhone 15 Pro can now maintain a stable speed of 60FPS, and AnTuTu's overall score has also been significantly improved.
Work to upgrade the iPhone 15 Pro's cooling solution was done by an unnamed Chinese content creator, Revegnus shared proof of the results on X without naming the person behind the scenes. In any case, the heat pipe modification has allowed Apple's 6.1-inch flagship machine to drop 10% in temperature when running intensive applications, and the improvement in the 3DMarkSolarBarUnlimited benchmark test is also quite obvious.
Due to the lack of effective heat dissipation solutions for the iPhone 15 Pro and iPhone 15 Pro Max, the sustained performance of the A17 Pro has also been affected, so Apple is said to be exploring graphene heat dissipation solutions for next year's iPhone 16 series. However, there is no word yet on whether this type of heat sink will be more efficient than using heat pipes, and it is worth mentioning that the latter is the most expensive.
This attempt proves that when these leading companies need to focus more on improving the cooling systems of high-end products, rather than just investing resources in mass-producing more cutting-edge chips, they are unable to exert their strength due to thermal issues.