FroreSystems, the developer of the world's first solid-state active cooling chip AirJetMini, brought a new solid-state cooling chip AirJetMiniSlim to CES2024. It is thinner, lighter, smarter and more advanced than the previous generation, bringing better heat dissipation and lower space cost to electronic products that require smaller size and higher performance.
AirJet MiniSlim adopts the same groundbreaking solid-state active cooling design as its predecessor, and adds three new features while maintaining silent, lightweight features and better heat dissipation than traditional fans. AirjetMiniSlim is only 2.5mm thick and weighs only 8g. Compared with AirJetMini, the thickness is reduced by 0.3mm and the weight is reduced by 1g, but the heat dissipation capacity remains the same. AirJet MiniSlim also introduces smart self-cleaning features to meet the challenges faced by the entire industry to defeat dust.
The AirJet MiniSlim's self-cleaning feature solves this problem by automatically reversing the airflow to remove accumulated dust from the AirJet dust filter. This ensures that AirJet maintains peak performance over the long term and maintains the high performance of the host device. AirJet MiniSlim also introduces the Thermoception function, allowing AirJet to independently sense its own temperature. This innovation enables AirJet MiniSlim to autonomously optimize performance and maximize heat removal without relying on temperature sensors in the host device, bringing new possibilities to cooling devices that lack integrated CPU and temperature-sensing components.
Dr. Seshu Madhavapeddy, founder and CEO of Frore Systems, said: "Reducing chip thickness by 0.3 mm is a game changer for products that require excellent thermal management in increasingly thinner devices. AirJet MiniSlim will bring much-needed performance improvements to ultra-thin electronic devices such as fanless laptops, tablets and smartphones."