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[Agency: CoWoS-L is expected to remain the mainstream packaging solution for AI chips by 2028] September 18th, according to TrendForce’s latest semiconductor advanced packaging industry research, as GPU manufacturers and very large cloud service providers (CSP) continue to develop more powerful and versatile AI chips, one of the development focuses of 2.5D packaging technology is to expand the packaging area. Among them, although TSMC CoWoS-L faces competition from Intel EMIB-T, it is expected to remain the mainstream packaging solution for AI chips by 2028 due to its technological maturity and yield advantages.
AI 🕐 2026-09-18 14:52
#AI chip #semiconductor #Intel #TSMC #GPU #chip #AI #semiconductor chip
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