[Biren Technology and Shanghai University jointly build the "Integrated Circuit Intelligent Chip Joint Laboratory"] September 8th, recently, Biren Technology and Shanghai University announced the joint establishment of the "Integrated Circuit Intelligent Chip Joint Laboratory". Relying on the joint laboratory platform, the two parties will focus on cutting-edge areas such as AI chip optical interconnection and new heat dissipation technologies to carry out collaborative research, jointly apply for national and local scientific research projects, and build a long-term collaborative innovation system that closely integrates industry, academia, and research. At the same time, the two parties will further promote the collaborative education between schools and enterprises, jointly build special classes for master's and doctoral degrees in engineering and customized classes for fresh graduates, and jointly cultivate high-quality talents in the field of integrated circuits.