B[CITIC Securities and others have invested in Hongmao Microelectronics, a subsidiary of Yangtze River Storage] On September 2, Tianyancha App showed that Hongmao Microelectronics (Shanghai) Co., Ltd. has recently undergone industrial and commercial changes, adding CITIC Securities Investment Co., Ltd., Gongqingcheng Jingcheng Venture Capital Fund Partnership (Limited Partnership), etc. as shareholders. The company was established in June 2002. Its legal representative is CHENG WEIHUA, with a registered capital of approximately 2.47 billion yuan. Its business scope includes packaging, testing and processing services of semiconductor integrated circuit devices. Shareholder information shows that the company is currently jointly held by Yangtze Storage Holdings Co., Ltd. and the above-mentioned new shareholders. B[IDAS 2026 Design Automation Industry Summit was held in Shanghai: Shanghai will accelerate EDA/IP breakthroughs and strengthen cutting-edge technological innovations such as AI EDA] September 1st, according to the Shanghai Economic and Information Technology Commission, on the morning of September 1st, the "IDAS 2026 Design Automation Industry Summit" was successfully held at Shanghai Zhangjiang Science Hall. The summit focused on industry development hotspots such as Tao's Law, system collaboration and innovation for discussions and exchanges. EDA is a basic software tool for chip design, manufacturing, packaging and other aspects, and it is also the basis for supporting the ecological construction of the integrated circuit industry. Under the guidance and support of the Ministry of Industry and Information Technology, Shanghai has actively formulated and implemented EDA/IP innovative development support policies, established industry merger and acquisition funds, established the Shanghai EDA/IP Innovation Center and the EDA Development Promotion Association, accelerated the improvement of the industrial ecology, and helped enterprises become bigger and stronger. In the next step, Shanghai will focus on the innovative development of the entire integrated circuit industry chain, accelerate the construction of platform carriers, accelerate EDA/IP breakthroughs, strengthen cutting-edge technological innovations such as AI EDA, support product application promotion, continue to optimize the industrial ecology, and accelerate the creation of an integrated circuit design automation innovation highland with international influence and competitiveness. B[Zhipu responds to the question of "knowledge only after training": The next generation base model is already advancing GLM-6.0, aiming at "self-evolution"] September 1st, at the 2026 semi-annual performance communication meeting held on the evening of August 31, an analyst raised the market's doubts about Zhipu's "knowledge only after training" and asked why the company has been relatively restrained in parameter scale recently. Tang Jie, founder of Zhipu, said that the next generation model will still expand the base size, and at the same time control the activation parameters to avoid the decline in inference speed and increase in costs. In terms of computing power, Zhipu revealed that it has achieved large-scale inference with 100,000-level domestic chips, and the cost of inference per Token has dropped by 80% from the beginning of the year. GLM‑5.3‑Flash is Zhipu’s first model that fully relies on domestic chip clusters to provide services under ultra-large-scale real traffic. The company said that compared with the initial baseline of the same hardware, the end-to-end service performance of this model has been improved by 3 times. Tang Jie summarized one of the future directions of GLM-6.0 as self-evolution, "This is a big challenge. The biggest problem is that the model can judge by itself when to stop and when to correct itself. This is the biggest problem, rather than simply training the model to a larger size. In future models, this is a key research focus." (every sutra) B[Northern Huachuang President Dong Boyu: This year, wafer fab customers have begun to proactively initiate joint research with the company and promote collaborative innovation] "Science and Technology Innovation Board Daily" reported on the 1st that Dong Boyu, the president of Northern Huachuang, said in a speech at the 2026 CEPEA main forum that before 2025, the domestic semiconductor industry will be highly dependent on the industrial path and the iteration speed of the equipment link will be slow. But he also said, "Starting from 2026, we have deeply felt that wafer fab customers have begun to proactively initiate joint research with Northern Huachuang to promote collaborative innovation, return to the underlying technical logic, explore and define semiconductor equipment development, and move from early parameter benchmarking to real solution design. The proportion of forward design of product technology has increased significantly." (Guo Hui, reporter of Science and Technology Innovation Board Daily) A[Ministry of Industry and Information Technology: Organize service providers to take the lead in forming "artificial intelligence application service groups" such as digital resonance, computing and computer collaboration] On August 31, the General Office of the Ministry of Industry and Information Technology issued a notice on launching a special action to cultivate artificial intelligence application service providers. It pointed out that the level of service supply should be improved. Organize service providers to take the lead in forming "artificial intelligence application service groups" such as modeling and mathematical resonance, computing and computer collaboration, and work with upstream and downstream units to create integrated solutions. Coordinate and make good use of innovation carriers such as national artificial intelligence application pilot bases and technology business incubators in the region to provide service providers with basic conditions such as technology research and development, testing and verification, and pilot maturity, accelerate solution innovation, and support the development and growth of service providers who are "specialized, specialized, and innovative." Support service providers to carry out targeted research on key technical problems such as software and hardware adaptation and multi-model collaboration. Service providers are encouraged to improve their integrated application capabilities for basic software and hardware products such as safe and reliable operating systems, databases, and artificial intelligence training and reasoning chips. Promptly push various artificial intelligence software and hardware product security risk information and risk events to service providers. Guide service providers to embed network security, data security, ethical governance, business compliance and other management requirements into the entire process of research and development, deployment, and application, changing passive responses to proactive prevention and control. A[Some high-end computing power companies’ orders are scheduled to be three years later] August 31st, in August, the semi-annual report of the leading domestic AI chip was released intensively. Last Friday, Biren Technology released its financial report, with revenue increasing nearly 20 times. In addition, leading companies such as Cambrian and Moore Threads have achieved substantial revenue growth. Behind the surge in performance is the shortage of high-end computing power. Currently, the high-end computing power supply side is experiencing a shortage across the entire chain, with orders from some companies already scheduled for three years. This is a microcosm of the current hot high-end computing power market. Not only are downstream intelligent computing center resources in short supply, but orders for midstream system integration are also being released intensively. Several computing power service providers said that the company's orders have maintained rapid growth for two consecutive years. Some companies said that in the past year or so, their customers have increased by about 10 times. In the upstream chip sector, the surge in demand has also driven up both volume and price. According to industry research data, the demand for domestic AI chips in 2026 will be about 4 million units, with actual delivery of about 3 million units, leaving a million-level production capacity gap. The industry generally believes that domestic chips are in a strong upward cycle in high-end AI chips. Recently, many domestic chip companies have disclosed financial reports, and the data shows the characteristics of a collective explosion. (CCTV Finance) A[Orders scheduled until the end of the year, the 100 billion liquid cooling track is accelerating to heat up] August 30th, in the past, data centers mainly relied on fans and air conditioners to "cool". However, after the accelerated implementation of high-power computing clusters such as Wanka Intelligent Computing Center and super nodes, chip power consumption continues to rise, making traditional air cooling increasingly difficult. As a result, liquid cooling was quickly pushed to the forefront. Industry insiders said that after the power of a single machine exceeds 100 kilowatts, the pressure of cold plate liquid cooling will increase significantly; when the power of the AI server cabinet reaches more than 200 kilowatts, the immersion solution will have more advantages. With the expansion of demand, competition quickly spread to the production side. On the high-end AI server production line in Jinan, Shandong, a batch of liquid-cooled servers are being assembled and tested and are about to be delivered and put into production; in Laixi, Qingdao, Shandong, there is a liquid-cooled core equipment component CDU assembly line, and orders have been scheduled until the end of December; in Foshan, Guangdong, a liquid-cooled component manufacturer's orders, output value, and delivery volume this year have all increased nearly 100% year-on-year. CCID Consulting data shows that China’s liquid cooling data center market size will reach 15.98 billion yuan in 2025, a year-on-year increase of 45.2%. According to predictions from industry organizations, the global smart computing liquid cooling market may exceed 100 billion yuan in 2026. As long as the power of AI servers continues to rise, the density of cabinets continues to increase, and the construction of smart computing centers continues, the smart computing liquid cooling market will continue to expand. (CCTV Finance) A[A16z, a well-known venture capital firm in Silicon Valley, establishes a US$1.1 billion fund to deploy chips, memory and robots] On August 30, a16z, a well-known venture capital firm, is placing a heavy bet on the hardware field and has raised US$1.1 billion for its first fund focused on hardware infrastructure. The fund, called "Machine Age", will focus on investing in artificial intelligence processors, memory chips, network equipment, data storage, robots and other fields.
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