BOE is preparing to invest in a semiconductor glass substrate carrier mass production line, which is expected to replace silicon materials

Abstract:

Chen Yanshun, chairman of BOE, delivered a keynote speech at the opening ceremony of the company’s annual event IPC2026 held at the Beijing National Convention Center Phase 2 on September 22, saying that the company is preparing to invest in a semiconductor glass substrate carrier mass production line.

Chen Yanshun said,

BOE will further consolidate the display industry, which is the foundation of the company's growth, and is expanding its optoelectronic fusion technology to new areas such as semiconductor glass substrate carriers and perovskites.

It is understood that

semiconductor glass substrates are mainly divided into categories such as glass core, glass interlayer and glass carrier, and are regarded by the industry as a technology that is expected to replace silicon materials.

As the demand for artificial intelligence expands and the size of semiconductor substrates continues to increase, advanced packaging technologies such as glass cores are receiving more attention. As display manufacturers have accumulated rich experience in glass substrate processing, major panel companies have shown interest in semiconductor glass substrate technology.

Chen Yanshun proposed a "1+4+N+ecological" business structure, in which "1" refers to the display business as the main force, and "4" covers the Internet of Things, sensors and solutions, micro/mini light-emitting diodes (MLED), smart medical and engineering integration and other fields.

He also used the "Nth degree curve" to explain the growth theory of industries and enterprises starting from 2024, believing that industries and enterprises will encounter bottlenecks after experiencing initial growth, and can still achieve new growth through innovation again.