Abstract:
Under the framework of the establishment of the "United Microelectronics Company" (ОМК), Russia plans to build three new chip factories, one of which is a "forward-looking mass production" factory for 300mm wafers and 14nm process production of chips.
According to the investment schedule, the preliminary design of this 300mm factory will be launched in 2027, and the 14nm basic process plan will be demonstrated. Preliminary preparations will last two years and will be completed in 2029, and the factory construction itself will be completed by 2036.
The three factories have a clear division of labor. The 300mm wafer factory is responsible for manufacturing chips directly on silicon wafers; the module factory is responsible for packaging and assembling chips into finished components such as power supplies, displays, and navigation; and the OSAT factory is responsible for the production of packaging substrates and module substrates.
The first to be built is the module factory, which is planned to be put into production in the third to fourth quarter of 2028. The OSAT factory is planned to be completed in 2031. But for the most difficult 300mm wafer fab, the industry believes that "2036 is more like a target deadline to strive to achieve."
The scale of investment is staggering.
By 2036, the total investment in ОМК will reach 1.101 trillion rubles (approximately RMB 87 billion). Among them, 1.031 trillion rubles will be used for production investment, 50 billion rubles for design, and 20 billion rubles for the establishment of a breakthrough technology fund.
The funds are shared between the government and Sberbank. It is planned to invest 170 billion rubles in 2027, of which savings banks will invest 41 billion rubles and the government will invest 129 billion rubles. About 527 billion rubles will be invested from 2028 to 2031.
The cost of a 14nm300mm wafer fab is approximately US$10 billion (approximately RMB 67.1 billion). But the real bottleneck is not funds, but equipment. Experts interviewed pointed out that
obtaining photolithography machines that can support 28 to 14nm processes is the biggest difficulty.
Russia’s previously announced microelectronics roadmap shows that it plans to achieve mass production of 65nm in 2026, break through 28nm in 2027, and conquer 14nm in 2030.
However, there is a clear gap between the 2036 factory completion time in the ОМК strategic document and the 2030 goal of conquering 14nm in the road map.
Comments