Abstract:
SK Hynix said on Friday it has demonstrated its next-generation artificial intelligence (AI) memory technology, aiming to expand the boundaries of AI infrastructure beyond traditional high-bandwidth memory (HBM). The company released these technologies at the OCP Global Summit 2026 held in California, USA, from Tuesday to Thursday local time. The summit is an annual conference organized by the Open Compute Project Foundation (OCP Foundation) that brings together engineers and industry leaders.
The South Korean chip giant said its exhibition area is divided into two parts.
The front area, known as the "Storage Zone," showcases the company's flagship products, while the larger back area, known as the "System Demonstration Zone," focuses on storage solutions designed to support the next-generation server ecosystem.
Kim Ho-sik, Senior Vice President of SK Hynix, introduced MARS (Memory-Centric AI Rack-Scale System) - a decoupled rack-level architecture designed to achieve seamless collaboration of computing resources and storage resources.
Kim highlighted progress in High Bandwidth Flash (HBF), a technology designed to meet the industry's growing demand for storage capacity.
In addition, the company also released a second-generation 256GB storage product based on the Compute Express Link (CXL) 3.2 standard. Compared with the previous generation product, the bandwidth of this product has been increased to more than twice, and the energy efficiency has also been improved by about 30%.
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