Intel Foundry Services (IFS) today announced that its first silicon manufacturing node utilizing extreme ultraviolet (EUV) lithography technology, Intel 4 node, will begin mass production. On September 29, Intel 4-node will start production at the company's factory (Fab34) in Leixlip, Ireland.
Company CEO Pat Gelsinger, Intel general manager of technology development Dr. Ann Kelleher and global chief operating officer Keyvan Esfarjani will attend the first wafer production commemoration ceremony.
Intel Gen 4 is an advanced foundry utilizing EUV technology, with transistor density and electrical characteristics comparable to TSMC’s 5nm and 4nm foundry nodes.
The first chips manufactured include computing chips for the company's Core "Meteor Lake" processors, which contain next-generation CPU cores. Compared with the current Intel 7-node, Intel 4-node has doubled the logic library area, increased equivalent power consumption by 20%, and introduced new metal-insulator-metal (MIM) capacitors.
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