Micron Technology recently officially launched the wafer fab expansion project in Hiroshima, Japan. The total investment in the project is approximately 1.5 trillion yen (approximately 630.3 billion yuan), which will be used to produce advanced memory chips such as high-bandwidth memory (HBM).Mainly catering to the demand for AI processors, it is expected that related products will begin shipping around the summer of 2028.
Japan’s Ministry of Economy, Trade and Industry will provide subsidy support of up to approximately 500 billion yen for the project. This expansion is an important part of Micron’s global AI storage capacity expansion strategy.
Micron is also promoting large-scale advanced process investments in Idaho and New York states in the United States to comprehensively enhance its DRAM and HBM supply capabilities.
At the project launch ceremony, Micron CEO Sanjay Mehrotra said: "Micron's first HBM production wafer for AI core storage technology is manufactured in Hiroshima. When American courage meets Japanese exquisite craftsmanship, what you get is not a compromise, but a world-class product."