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[SanDisk CEO: The first high-bandwidth flash memory (HBF) has completed tape-out and is expected to deliver the first batch of samples to customers next year] October 30th, SanDisk Chairman and CEO David Goeckeler said on Thursday, Eastern Time, in the first fiscal quarter conference call of fiscal year 2027 that the first high-bandwidth flash memory (HBF) memory chip has completed tape-out. HBF is a new storage architecture for inference with comparable read bandwidth to HBM but with greater capacity... designed to complement HBM by bringing NAND-level capacity closer to the processor. ” The first samples are expected to be delivered to customers next year.
semiconductor chip 🕐 2026-10-30 10:36
#processor #chip #semiconductor chip #memory chip #U.S. stock trends
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