Abstract:
On September 15, at today’s 2026 MediaTek Dimensity flagship new product launch conference, MediaTek’s next-generation flagship chip Dimensity 9600 Pro was officially released. According to the official introduction, Dimensity 9600 Pro uses TSMC’s 2nm process and has the industry’s highest 33 billion+ transistor precision design.
In addition, the "converged computing architecture" integrates hardware and software of heterogeneous computing cores such as CPU, GPU, NPU, and ISP, with AI capabilities as the core engine. The chip adopts a full large-core architecture, is equipped with dual ultra-large cores, and is equipped with AI computing power intelligent scheduling and intelligent memory scheduling technology to support parallel running of AI and APP.
Specifically, the processor has dual ultra-large cores C2-Ultra 4.55GHz, three cores C2-Pro 4.35GHz and three cores C2-Pro 3.1GHz. It is equipped with 34.5MB L2+L3+ system cache and is the first to support LPDDR6 memory and UFS 5.0 flash memory. Compared with the Dimensity 9500, the ultra-large core power consumption dropped by 37% and the multi-core power consumption dropped by 61%.
GeekBench V6.4 running score data shows that the chip has a single-core score of 4276 points and a multi-core score of 12650 points. Compared with the previous generation Dimensity 9500, its single-core score is 3666 points and multi-core score is 11014 points. Based on this calculation, the single-core performance of Dimensity 9600 Pro is improved by about 17%, and the multi-core performance is improved by about 15%.
In terms of NPU, Dimensity 9600 Pro adopts a dual NPU architecture and is equipped with the APU 1090 super-performance AI processor. The INT4 computing power is doubled, the peak performance is increased by 51%, and the number of words generated per watt is increased by 55%. It is also equipped with a super energy-efficient NPU, which supports ultra-low power consumption and full-time sensing, reducing power consumption by 40%. The chip also supports a new generation of large model compression technology and MoE large model local acceleration.
In addition, MediaTek officially announced that it has ranked first in the global smartphone SoC market share for six consecutive years.
Comments