Micron officially launches the industry’s highest density, single-layer cell (SLC) NAND flash memory with outstanding radiation resistance. It is the first NAND to receive formal and complete space certification.This product has a single chip capacity of 256Gb and is the first product to enter its space-grade memory series. In the future, this series will also launch space-grade NOR and DRAM solutions. Currently, the products have begun to be supplied, leading the field of space-grade products from major storage manufacturers.
With the rapid growth of commercial and government space missions, there is an increasingly urgent need for reliable, high-performance storage that can directly process big data on orbit. AI edge computing is driving aircraft to achieve autonomous analysis and decision-making, reducing dependence on ground instructions and accelerating the process of intelligent space missions.
In order to ensure the stable operation of products in the extreme environment of space, Micron conducted a one-year temperature cycle, defect detection and 590 hours of dynamic aging testing in accordance with the strict NASA PEM-INST-001 Level 2 standard.The product has also passed the strict assessment of total radiation dose (TID) and single event effect (SEE), and complies with key standards such as MIL-STD-883 TM1019, ASTM F1192 and JEDEC JESD57.
Relying on its technology accumulation in the field of industrial and automotive embedded memory, Micron's radiation-resistant products have cooperated with Mercury Systems and are applied to solid-state data recorders.The equipment is serving NASA's Surface Mineral Dust Investigation (EMIT) mission, helping scientists collect and store key data to support earth and space research in extreme environments.
In the future, Micron will continue to launch space-grade storage products that meet the needs of the next generation of aerospace, laying a solid foundation for the in-depth application of artificial intelligence and edge computing in the aerospace field.
