Chip giant Intel and UMC have reached a cooperation to jointly promote the research and development of advanced processes. Under the leadership of CEO Chen Liwu, Intel is actively deploying the wafer foundry field and striving to compete head-on with TSMC.When it comes to foundry, the first thing people think of is often TSMC. But it is worth noting that in the semiconductor industry, UMC is the second largest chip manufacturing company in Taiwan, with market share second only to TSMC.
Not only that, UMC is also the first wafer foundry company in Taiwan. It has accumulated rich manufacturing experience in mature process nodes, and its products are widely used in various industrial fields.
Now, UMC seems to be showing strong interest in getting into advanced process semiconductor manufacturing. According to reports,The company has joined hands with Intel, and the two parties will jointly tackle the 3nm and 12nm processes, and the relevant production lines will be located at Intel's factory in Arizona, USA.
It is reported that the chips manufactured by the two companies on the 12nm process node will mainly be targeted at the Internet of Things and WiFi fields. The first batch of design kits is expected to be delivered to customers this year so that tape-out can be started early next year, with mass production planned for the end of 2027.
As for the 3nm process, the two parties are still in the joint research and development stage. The goal is to create a 3nm node that is equivalent to TSMC's technology level, thereby helping Intel gain a larger share in the global foundry market.
