Recently, it has been reported that many companies have become interested in Intel's EMIB advanced packaging technology, including industry giants such as Marvell, Google, Meta and MediaTek. They may create a new model of "front-end wafer production with TSMC and back-end packaging with Intel".
Intel will replace TSMC's CoWoS packaging. After all, the latter's packaging production capacity is far from meeting market demand. In addition, public recruitment information shows that both Apple and Qualcomm are looking for personnel with expertise in Intel's EMIB advanced packaging technology.
According to TECHPOWERUP, Apple is already evaluating Intel's process and considering alternative packaging routes. As a partner, Broadcom assisted Apple in designing the "Baltra" AI chip. It was originally intended to use TSMC's CoWoS packaging, but limited production allowed Apple and Broadcom to change their minds, and EMIB packaging became a possible option.
According to recent reports, the cooperation between Apple and Intel is not limited to advanced packaging, but also wafer foundry. It is rumored that Apple will choose Intel 18A-P process to produce low-end M series chips as soon as 2027 for MacBook Air and iPad Pro. Apple previously signed a confidentiality agreement with Intel and obtained 18AP PDK 0.9.1GA, and is waiting for Intel to release 18AP PDK 1.0/1.1 in the first quarter of 2026. In this case, it seems more logical to take the lead in cooperation in advanced packaging.
Supply chain sources revealed that Nvidia and AMD are evaluating the Intel 14A process. Some analysts pointed out that chip design companies are increasingly relying on advanced packaging technology, and packaging production capacity has become one of the main constraints in chip production. To this end, advanced manufacturing processes and packaging will be considered together, and exploratory measures may be taken to spread risks and provide more reliable supply.