56 articles
Abstract: On September 15, at today’s 2026 MediaTek Dimensity flagship new product launch conference, MediaTek’s next-ge
Abstract: As the competition for next-generation advanced process production capacity becomes increasingly fierce, Qualc
Abstract: As the demand for artificial intelligence and high-performance computing chips continues to explode, TSMC is a
Abstract: As global demand for artificial intelligence and high-performance computing (HPC) chips continues to grow out
Abstract: SMIC, the largest wafer foundry in mainland China, recently released its latest operating data, showing that t
Summary: The advancement speed of TSMC’s next-generation 1.4nm process may once again exceed market expectations. Accord
Abstract: ASML is working with customers to develop larger masks for next-generation High-NA EUV lithography equipment.
Abstract: On the eve of Apple’s upcoming autumn new product launch, the official platform of Verizon, the largest teleco
Summary: According to Bloomberg, Apple’s upcoming iPhone 18 Pro will use a narrower Smart Island, an adjustment that is
Summary: ASML has secured a commitment from a top chipmaker to use its latest semiconductor production equipment and lau
Abstract: On September 8, MediaTek’s official Weibo announced that the Dimensity flagship chip series will usher in the